The 3D Collaboration & Interoperability Congress focuses on CAD collaboration and interoperability for the entire product lifecycle. More than ever before, information needs to be digital and fully associated as Model-Based Definition (MBD), Model-Based Enterprise (MBE), Smart Manufacturing, and Internet of Things (IoT) continue to evolve. For discrete manufacturing, this means CAD interoperability and collaboration to enable the digital thread.
3D CIC will be held October 3-5, 2017 in Golden, Colorado, with the theme: UNITE: Engineering & Shop Floor Collaboration. Real users share their experiences for all stages of the product lifecycle, with the focus on real-world challenges and solutions for turning design concepts into manufacturing product reality using 3D models.
New this year is the coordination of the Quality Information Framework (QIF) Summit with 3D CIC, through partnership with the Dimensional Metrology Standards Consortium (DMSC). Comprising the QIF Summit are the biennial QIF Symposium, QIF Working Group meetings, and a DMSC member meeting. 3D CIC has expanded to three days to feature the QIF Symposium on the third day.
For more information and to register please visit: https://www.action-engineering.com/3dcic